Burn-in Temperature Projections for Deep Sub-micron Technologies
نویسندگان
چکیده
Burn-in faces significant challenges in recent CMOS technologies. The self-generated heat of each IC in a burn-in environment contributes to larger currents that can lead to further increase in junction temperatures, possible thermal run away, and yield-loss of good parts. Calculations show that the junction temperature is increasing by 1.45X/generation. This paper estimates the increase in junction temperature with scaling and discusses the optimal burn-in temperature with scaling. Our research indicates that the burn-in temperature must also be reduced with technology scaling. The impact on commercial burn-in ovens is also described.
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